From Before its News
Article written by Kimm Fesenmaier
Monday, December 10, 2012 10:37
Soon there may be a cellphone that can see though walls and into other objects as Caltech engineers have made tiny, low-cost terahertz imager chips that could be incorporated into cellphone cameras.
A secret agent is racing against time. He knows a bomb is nearby. He rounds a corner, spots a pile of suspicious boxes in the alleyway, and pulls out his cell phone. As he scans it over the packages, their contents appear onscreen. In the nick of time, his handy smartphone application reveals an explosive device, and the agent saves the day.
Sound far-fetched? In fact it is a real possibility, thanks to tiny inexpensive silicon microchips developed by a pair of electrical engineers at the California Institute of Technology (Caltech). . . . Read Complete Report